Consolidated Power: Charting the X-in-1 Future of EV Electronics

The automotive industry is in the midst of a foundational architectural shift. Driven by the transition toward Software-Defined Vehicles (SDVs), original equipment manufacturers (OEMs) are moving rapidly away from decentralized, discrete Electronic Control Units (ECUs) toward highly integrated, consolidated power electronics platforms. In the Electric Vehicle (EV) ecosystem, this evolution is taking the shape of “X-in-1” architectures—where traction inverters, On-Board Chargers (OBCs), and DC-DC converters are packed into single, highly optimized units. While this consolidation dramatically reduces wiring harness complexity, weight, and vehicle assembly costs, it introduces severe engineering hurdles in high-voltage thermal management, electromagnetic interference (EMI/EMC), and lifecycle serviceability.

In a recent interaction with Rashmi Verma, Sundar Ganapathi, Chief Technology Officer – Automotive at Tata Elxsi, discussed how the company is actively guiding global and domestic OEMs through these complex engineering trade-offs. Ganapathi highlighted that successfully navigating this shift requires a holistic integration of hardware robustness, software flexibility, and service intelligence. From leveraging wide-bandgap Silicon Carbide (SiC) semiconductors to withstand 800V+ platforms, to implementing advanced AUTOSAR-based software abstraction and direct liquid cooling, Tata Elxsi is at the forefront of powertrain innovation. Backed by their strategic partnership with Infineon to develop application-ready EV solutions, the company is proving that the ultimate winners in the EV market will be the platforms that successfully blend compact hardware density with cloud-based predictive diagnostics to ensure scalability, reliability, and long-term production success.

How do you see the industry evolving from discrete ECUs toward fully consolidated EV power electronics platforms over the next 5–10 years?

The shift from discrete ECUs to consolidated EV power electronics is being driven by the software-defined vehicle journey. As vehicles become more connected and software-updatable, OEMs are looking to reduce wiring harness complexity, lower the number of ECUs, and simplify parts, inventory, and supply-chain overheads. In EVs, that is already reflecting as they move from separate ECUs to widely adopted 3-in-1 systems to a more broader X-in-1 architectures in future, where onboard charging, battery management, power distribution, inverter and motor controls start coming together. The key point is that consolidation may not make the electronics box cheaper in itself, but it can reduce total lifecycle cost through better design validation, easier maintenance, and improved post-warranty support. At Tata Elxsi, we are already supporting these transitions through our hardware and software design capabilities. In 2025, we

What are the biggest technical barriers today in integrating the traction inverter, OBC, and DC-DC converter into a single unit?

The biggest barriers in integrating the traction inverter, OBC and DC-DC converter into one unit come from the fact that these are high-voltage, high-power switching devices. The first challenge is thermal management: heat dissipation is high, so the design often needs more complex thermal management solution, which makes the mechanical packaging much more complex. Highly uneven heat generation may force overdesign (bigger cooling systems), reducing integration benefits. Also, it is hard to maintain optimal junction temperatures. The second major barrier is EMI/EMC. Once several high-switching functions are brought into a single box, electromagnetic interference, radiated emissions and conducted emissions become much difficult to control, especially under strict automotive regulations. What makes this harder than in many other ECUs in car electronics is that the systems are safety-critical and operate at much higher power levels. We are addressing this through strong hardware design capabilities in electronics and mechanical packaging, including a 3-in-1 water-cooled high-voltage system.

From a system engineering perspective, how do OEMs balance power density, thermal constraints, and serviceability in integrated architectures?

OEMs are balancing three things at once: power density, thermal constraints and serviceability. Integrated architectures are attractive because they improve packaging efficiency and reduce cost over the life of the vehicle, while enabling higher power density through more compact packaging and integrated thermal design. If one function such as onboard charging develops a fault, the repair process can touch the wider powertrain system, including traction inverter and motor control functions. That is where prognostics, connected vehicle data and over-the-air updates become critical enablers. The need for thermally informed architecture design becomes critical – Strategies such as thermal Zoning, Hierarchical cooling etc needs to be adopted. High power density subsystems are tightly integrated and thermally optimized. Modularity at the right hierarchy level- Failure-prone or service-critical elements remain modular and accessible. At Tata Elxsi, we work with OEMs to build these capabilities into consolidated powertrain systems. The industry is moving toward stronger cloud-based prognostic and software updates so that many issues can be resolved remotely and safely. In parallel, OEMs still need trained service technicians and dealership capability for the smaller set of hardware-driven repairs that will continue to remain.

How is the adoption of Silicon Carbide (SC) changing consolidation strategies in modern EV platforms?

Silicon carbide (SiC) is changing consolidation strategies because it supports the higher-voltage platforms that modern EVs are moving toward. The point of higher-voltage architecture is to reduce switching losses, improve efficiency and reduce thermal burden. Traditional switching devices become inefficient at these voltage levels, especially as commercial vehicles and larger platforms move toward 800 V systems. SiC therefore becomes a key enabler for high-voltage, low-current operation and helps OEMs consolidate power electronics more confidently. Lower switching/conduction losses (50–70% lower switching losses) helps in designing less bulkier cooling system. Higher thermal tolerance (≈ 175–200°C junctions) results in less isolation required. Higher voltage capability (800V+ platforms) helps achieve less current flow and thus, weight reduction. In practical terms, better switching efficiency means less heat, better power efficiency and a stronger case for X-in-1 integration. Our work with Infineon on high-voltage systems gives us practical experience in enabling this shift for Indian market OEMs. SiC is not just a component choice; it is part of the broader architecture shift toward more compact, more efficient EV platforms.

Do you believe zonal architectures and centralized compute platforms will eventually influence power electronics integration as well?

Yes, zonal architectures and centralized compute platforms will absolutely influence power electronics integration. In fact, they are closely linked to the end goal of the software-defined vehicle. As OEMs move toward a more zonal model, the business logic is straightforward: fewer ECUs, fewer parts, lower wiring harness weight, lower cost and better vehicle efficiency. The EV effect is important too, because reduced wiring and reduced weight can improve range. This pushes OEMs to consolidate not just body, infotainment and ADAS electronics, but also EV powertrain control units such as OBC, DC-DC converters, inverters, power distribution units, BMS and motor controls. The challenge is not whether this direction will continue, but how quickly OEMs can solve the thermal, safety and serviceability issues that come with it. We support OEMs in realising zonal and centralised compute architectures as part of their software-defined vehicle programmes, including the associated power electronics consolidation.

What role does software abstraction and AUTOSAR-based architecture play in highly integrated EV power electronics systems?

Software abstraction is one of the most important enablers in highly integrated EV power electronics. When onboard chargers, BMS and DC-DC converters, that were earlier handled by different suppliers are brought onto one platform, software can no longer stay tightly coupled to a specific hardware layer. OEMs need the freedom to reuse software, port it to newer, more power-efficient hardware and move across generations without starting from scratch. AUTOSAR is a strong way to achieve that because it gives a structured framework for application software, hardware communication and controller interaction. It also helps with multi-supplier ecosystems and supports portability, maintainability and functional safety compliance. In short, AUTOSAR is not the only route, but it remains one of the most widely accepted methods for keeping integrated architectures scalable and future-ready.

How do functional safety requirements such as ISO 26262 become more complex when multiple power conversion functions are combined into one housing?

Functional safety becomes more complex when multiple power conversion functions sit inside one housing because each function carries its own safety risk. An onboard charger, motor controller and powertrain system all have different safety requirements, and EV powertrain systems typically operate across ASIL B, C and D levels, with D being the highest. The challenge is to preserve modularity and ensure that one function does not interfere with another inside the same enclosure. ISO 26262 helps by providing guidelines such as freedom from interference, memory protection and built-in self-test mechanisms, which improve safe operation at system level. So, the standard does not remove complexity, but it gives OEMs and suppliers a clear framework to manage it responsibly. That is especially important in integrated EV systems where customer safety is directly tied to high-voltage management. Tata Elxsi assists OEMs in managing the increased functional safety complexity of integrated EV power electronics in line with ISO 26262 requirements.

What are the key EMI/EMC challenges observed in consolidated high-voltage systems, especially in compact EV platforms?

The key EMI/EMC challenge in consolidated high-voltage systems is that higher switching frequencies naturally create more emissions. Having such components in single metallic enclosure can amplify resonant frequencies which can affect the normal operation of the components. Isolation of HV and LV is one of the key concerns. Having both high voltage and low voltage outputs from the system (12V or 24V from DC-DC converter) calls for having bulky expensive differential mode and common mode filters to be incorporated to prevent the HV or LV lines getting polluted.

Grounding strategy also becomes much more complicated in this environment. For OEMs, the task is to ensure safe and reliable operation while meeting stringent automotive EMC requirements. In compact EV platforms, robust shielding, careful segregation of high-voltage and low-voltage domains, disciplined grounding strategies, and thorough validation become essential to meet stringent automotive EMC requirements and ensure safe, reliable operation. At Tata Elxsi, our hardware design expertise helps OEMs implement these measures effectively in consolidated systems.

How do thermal management strategies evolve when moving from standalone converters to integrated power electronics modules?

Standalone converters primarily rely on secondary pathways such as Thermal interface materials and/or baseplates bolted onto shared liquid cold plates. However, in the case of highly integrated compact X-in-1 systems, this method will not be sufficient. Hierarchical cooling strategies where a primary cooling loop will be supported by secondary localized cooling systems will be necessary.

Strategies like Direct liquid cooling where the power stack’s ceramic substrate is exposed directly to water-glycol coolant are tried out. Methods like double sided cooling where the heat dissipation happens from both sides of the substrate are becoming popular. Direct immersion cooling where the integrated assembly is immersed in a dielectric medium are being extensively explored. This approach offers a safe and lightweight alternative to heavy and bulky heat exchanger plates.

In addition to these, emerging techniques such as vapour chambers are also being considered. These are passive cooling methods that helps in absorbing temperature spikes caused by power surges. Our hardware and packaging design experience at Tata Elxsi enables us to help OEMs manage these EMI/EMC demands in integrated high-voltage platforms. The key is to design thermal strategy early, along with mechanical packaging and electronics layout, so that the cooling architecture supports both performance and durability over time.

In your experience, what differentiates a successful integrated power electronics platform from one that struggles in production deployment?

The key differentiator of a successful integrated power electronics platform will be the ability to deliver the same or better performance as that of standalone components – in terms of power handling, efficiency and reliability – at reduced cost, weight and size. The second is connected-vehicle capability that enables OTA updates, remote flashing and better diagnostics. The third is predictive diagnostics, which can help OEMs detect wear in critical components like DC-link capacitors before the system fails. That reduces downtime, improves customer confidence and lowers service burden. On the other hand, platforms that struggle usually lack one or more of these enablers: they are harder to diagnose, harder to service and more likely to force customers into avoidable downtime. In short, the winners are the platforms that combine hardware robustness, software flexibility and service intelligence in one architecture.